所屬學科：電子工程

具體地點：美國 Tampa, FL, USA

主辦單位：IEEE Electron Devices Society IEEE Microwave Theory and Techniques Society IEEE Solid-State Circuits Society

 

聯系人：Patrick Yue

E-MAIL：[email protected]

 

會議背景介紹：

The 2014 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium will be held 1-3 June in Tampa, Florida. In conjunction with the IEEE MTT‑S International Microwave Symposium, the RFIC Symposium opens Microwave Week 2014, the largest world-wide RF/Microwave meeting of the year.

 

The RFIC Symposium continues to build upon its heritage as one of the foremost IEEE technical conferences, increasing each year its impact and reputation of excellence. By bringing focus to the technical accomplishments in RF circuits, systems, and devices, the RFIC Symposium has become essential to both the academic and the industrial communities. This year's exciting technical program will showcase the latest innovations in RF integrated circuit design with sessions that cover a broad spectrum of topics.

征文范圍及要求：

Technical Areas: The conference will solicit papers describing original work in RFIC design, system engineering, system simulation, design methodology, RF integrated circuits, fabrication, testing and packaging to support a wide range of RF applications. Below is a list of application areas to be solicited for the conference (this list is preliminary and should not be perceived as limiting).

 

Wireless Mobile ICs: 3G/4G/LTE, WCDMA, TD-SCDMA, HSPA, WiMax, Mobile TV.

Wireless Connectivity: WLAN, 802.11xx, Bluetooth, FM, GPS, UWB, Wireless HD.

Low Power Transceivers: RFID, NFC, Zigbee, WPAN, WBAN, Biomedical, Sensor Nodes.

RF Front-End Circuits: RF and mm-wave LNAs, Mixers, VGAs, Phase Shifters, RF switches, & Integrated FEM.

Mixed-Signal RF & Analog Baseband Circuits: RF and BB Converters (ADC/DAC), Sub-sampling/Oversampling Circuits, and all analog baseband circuits including filters and modulators.

Reconfigurable and Tunable Frontends: SDR/Cognitive Radio, Wideband/Multi-band Front-Ends, Digital RF circuits/architectures, RF BIST, and reconfigurable data converters.

Large-Signal Circuits: Power Amplifiers (RF & mm-Wave), Drivers, Advanced TX circuits, Linearization.

VCOs and Frequency Multipliers: RF and mm-Wave VCOs, Frequency Multipliers.

Frequency Generation Circuits: PLLs, Synthesizers, ADPLL, DDS, Frequency Dividers.

Modeling and CAD: Active/Passive Devices, Packaging, EM Simulation, Co-Simulation.

Device Technologies: CMOS, SOI, SiGe, GaAs, MEMS, Integrated Passives, Reliability, Characterization, Testing.

mm-Wave SOCs: mm-wave SOC and SIP systems above 20GHz for data, video, and imaging apps, beam steering applications.

High-Speed Data Transceivers: Wireline, Wireless, Optical Transceivers, CDRs for High-Speed Data links.